n.封装...

To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.热超声倒装键合作为前沿封装技术具有良好的发展前景....

capsulation的音标：capsulation的英式发音音标为：[kæpsjʊ'leɪʃən]capsulation的美式发音音标为：[kæpsjʊ'leɪʃən]...